โโ(1) Material structure and composition analysisโโ
Crystal quality assessment: Detect lattice stress (strained silicon technology) through Raman peak shift (such as Si’s 520 cmโปยน peak); distinguish between single crystal, polycrystalline and amorphous silicon (such as a-Si vs. c-Si).
Thin film composition: Analyze the Ge content of SiGe alloy (the peak position is linearly related to the Ge concentration), and detect the chemical bond state of dielectric layers such as silicon nitride (SiโNโ) and silicon oxide (SiOโ).
(2) Process monitoringโโ
Annealing effect evaluation: Monitor the recrystallization process after ion implantation (Raman peak change of amorphous silicon โ crystalline silicon).
Epitaxial growth quality control: Detect the epitaxial layer thickness and defect density of wide bandgap semiconductors such as SiC and GaN.
(3) Failure analysis and defect detectionโโ
Local hot spot analysis: Locate the mechanical stress concentration area in the chip through Raman peak shift (such as cracks caused by package warping). Contaminant identification: Identification of organic residues (photoresist) or metal particles on the wafer surface (through SERS enhancement)
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
Equipment features: 1. Using maskless direct writing lithography technology, high-precision electron...
Equipment features: 1. Core advantages Fully automatic high-speed inventory, 20 times more efficient...
โโEquipment features: 1. Process principle โโDeposition mechanism: Potential-controlled directional deposition...
High-purity inert glove box system Equipment features: 1. Ultra-pure environment control Oโ/HโO๏ผ0.1ppm...
Tunnel furnace 1. Equipment features: Continuous conveyor belt/track conveyor Multiple temperature zones...
Vacuum furnace 1. Equipment features: Working temperature: 0-250โ Ultimate vacuum: 133Pa Furnace volume:...
High temperature furnace 1. Core parameters Limit temperature: 1500-1800โ Working temperature: 1450-1750โ...
1. Core performance Temperature range: 200-1300โ Temperature change rate: โค150โ/s (standard bare die...
1. Core functions Global surface flattening Single/double-sided polishing process Multi-material compatible...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
