Equipment features:
1. High-precision proximity gap control:
Adopt automatic parallel adjustment mechanism to accurately set the gap between mask and wafer to ensure exposure uniformity.
2. High-speed and high-precision alignment technology:
Independent high-speed image processing technology to achieve high-precision alignment, which can be adapted to thin, warped substrates and fragile wafers (such as crystal substrates, optional).
3. Precision contact pressure control:
Adopt unique contact pressure adjustment mechanism to ensure that the wafer and mask fit closely and improve exposure accuracy.
4. Efficient and stable wafer transmission:
The vacuum adsorption method of the wafer back manipulator realizes high-speed, high-precision and stable automated handling
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
Equipment features: 1. Using maskless direct writing lithography technology, high-precision electron...
Equipment features: 1. Core advantages Fully automatic high-speed inventory, 20 times more efficient...
Equipment features: 1. Process principle Deposition mechanism: Potential-controlled directional deposition...
High-purity inert glove box system Equipment features: 1. Ultra-pure environment control O₂/H₂O＜0.1ppm...
Tunnel furnace 1. Equipment features: Continuous conveyor belt/track conveyor Multiple temperature zones...
Vacuum furnace 1. Equipment features: Working temperature: 0-250℃ Ultimate vacuum: 133Pa Furnace volume:...
High temperature furnace 1. Core parameters Limit temperature: 1500-1800℃ Working temperature: 1450-1750℃...
1. Core performance Temperature range: 200-1300℃ Temperature change rate: ≤150℃/s (standard bare die...
1. Core functions Global surface flattening Single/double-sided polishing process Multi-material compatible...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
