ICP RIE System (III-V and Metal Etching)

Equipment features:
1. Fully automatic and efficient etching system

Using high-density plasma technology to achieve ultra-high-speed etching of compound semiconductor materials; supporting fully automatic parallel process processing, significantly improving production efficiency
2. Multi-size wafer compatibility

Adaptable to 4/6/8-inch wafer specifications, equipped with intelligent wafer recognition and automatic calibration system
3. Strong bonding material processing capability

Plasma source designed specifically for high bond energy materials, optimized RF power coupling system, to ensure stable and efficient etching performance
4. Wide range of material applicability

Supports etching of a variety of compound semiconductor materials: third-generation semiconductors: silicon carbide (SiC), silicon nitride (Si₃N₄) new functional materials: aluminum scandium nitride (AlScN), aluminum nitride (AlN), metal materials: molybdenum (Mo), ferroelectric materials: lead zirconate titanate (PZT)
5. Scientific research-level process control

Precise process monitoring system; programmable process parameter control; real-time data acquisition and analysis function

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Application Areas

Each piece of equipment serves a purpose in advancing the study of MEMS devices, LiTaO3, PZT（PbZrTiO₃）, photodiodes, metal oxides, metals and other semiconductors.
The materials and technologies listed in this presentation are carefully selected to support the development and production of cutting-edge sensors. Each component is tailored for the fabrication of the sensors previously outlined, including metal oxide sensors, optical detectors, gas detection technologies, and piezoelectric/pyroelectric devices. The selected technologies ensure compatibility with 6-inch wafers to meet the requirements of industrial-scale manufacturing processes.
Every step of the process, from material preparation to device assembly, has been optimized to support high-volume production while maintaining the flexibility to accommodate a variety of sensor types, including MEMS devices, UV/IR sensors, and biosensors. The focus remains on ensuring the integration of the most reliable and efficient technologies to produce high-quality sensors for diverse applications.

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IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

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We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

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Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

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PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.