FCCSP Substrate

Product Introduction

The product generally adopts the pressing lamination process of semi-curing sheets , and line formation uses an improved semi-additive (amSAP) process or subtraction (Tenting) process. The FCCSP (Flip Chip Chip Scale Package) package board in the form of inverted chip packaging for the product.

The features of this type of product include small size, light weight, and relatively fewer layers. They are used in wearable, storage, and RF (radio frequency) applications

Package Structure

Features

Smaller micro via by new-generation laser drilling machine AMSAP

Fine Line/Space by amSAP process

Ultra thin board by Coreless or ETS Process

Thin Thickness

Small size

High Density

Build-up Structure

Process Capability

Process Capability		Applications
· Layer Count:	2~8 SiP 4~16层	· AP
Board Thickness	· 0.15~2.0mm	· BB
amSAP Line/Space	· 15/15μm	· RF
Tenting Line/Space	· 40/40μm	· PMIC
· Via/Land	Φ55/85μm	· Memory
· SRO	· Φ60μm	MEMS & Sensor
· SRO/Land Reg	· ±12.5μm	·
· Surface Finish	ENEPIG、OSP、ENEPIG+OSP	·
Micro bump Pitch	· 110μm
· Coreless	· (2025H1)
· Layer Count	· 3~11
Board Thickness	· 0.10~1.0mm
· ETS	· (2025H1)
· Layer Count	· 2~4
Board Thickness	· 0.10~0.25mm
· Line/Space	· 10/10μm

Roadmap-FCCSP&SiP

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Application Areas

FCCSP（Flip-Chip Chip Scale Package，）The package substrate realizes fine lines (line width ≤ 10 μm) through the modified semi-additive process (MSAP) and the embedded line process (ETS), and supports coreless substrates to improve heat dissipation efficiency. It is suitable for the following fields

1. Mobile communications and consumer electronics: smartphone application processors (AP), baseband processors (BB), WiFi/BT chips, power management chips (PMIC), RF modules, etc.

2. Automotive electronics: in-vehicle infotainment systems, advanced driver assistance systems (ADAS), autonomous driving controllers, and automotive-grade MCUs.

3. Artificial intelligence and 5G communications: AI accelerators (such as edge computing chips), 5G base station RF front-ends, and optical modules.

4. Storage chips and high-performance computing: USB flash drives, mobile hard disks, server memory controllers, and high-bandwidth memory (HBM) interfaces.

5. Internet of Things and industrial equipment: smart home modules, industrial automation controllers, medical imaging equipment.

6. RF and microwave modules: 5G millimeter wave antenna (AiP), radar system, satellite communication.

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IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.