Equipment features:
โโ1. Innovative optical system design
โโAdopt achromatic compensator technology to eliminate wavelength-related errors
โโDual rotating compensator synchronous control system with an accuracy of 0.01ยฐ
โโFull parameter measurement to obtain complete polarization information
โโ2. Advanced data analysis capabilities
โโSupport complex nanostructure modeling:
โโOne-dimensional/two-dimensional nanogratings
โโAnisotropic materials
โโMultilayer film structure
โโ3. Precision measurement performance
โโFilm thickness measurement resolution: 0.1ร
โโOptical constant measurement accuracy: ยฑ0.001
โโNano grating constant measurement error: <0.1nm
โโ4. Wide range of applications
โโSemiconductor advanced process detection
โโNew display material research and development
โโOptical coating characterization
โโNanostructure material analysis
โโPhotovoltaic device measurement
โโ5. Intelligent operating system
โโFully automatic measurement process
โโMulti-language operation interface
โโRemote monitoring function
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
Equipment features: 1. Using maskless direct writing lithography technology, high-precision electron...
Equipment features: 1. Core advantages Fully automatic high-speed inventory, 20 times more efficient...
โโEquipment features: 1. Process principle โโDeposition mechanism: Potential-controlled directional deposition...
High-purity inert glove box system Equipment features: 1. Ultra-pure environment control Oโ/HโO๏ผ0.1ppm...
Tunnel furnace 1. Equipment features: Continuous conveyor belt/track conveyor Multiple temperature zones...
Vacuum furnace 1. Equipment features: Working temperature: 0-250โ Ultimate vacuum: 133Pa Furnace volume:...
High temperature furnace 1. Core parameters Limit temperature: 1500-1800โ Working temperature: 1450-1750โ...
1. Core performance Temperature range: 200-1300โ Temperature change rate: โค150โ/s (standard bare die...
1. Core functions Global surface flattening Single/double-sided polishing process Multi-material compatible...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
