โโEquipment features:
1. Process principle
โโDeposition mechanism: Potential-controlled directional deposition of metal ions (Cuยฒโบ/Niยฒโบ), rate 0.1-10ฮผm/min
โโFunction realization:
Conduction: Cu resistivity โค2.0ฮผฮฉยทcm
Heat dissipation: Cu thermal conductivity โฅ400W/mยทK
Support: Adjustable stress ยฑ100MPa
2. Process application
โโInterconnection technology:
Cu interconnection: Damascus/dual damascene process, uniformity โคยฑ3%
TSV filling: aspect ratio 10:1, void ratio <0.1%
UBM: Ti/Cu/Ni stacking, thickness accuracy ยฑ5nm
3. Technical advantages
โโPrecision control:
Current density ยฑ1mA/cmยฒ
Temperature ยฑ0.5โ
Additives ยฑ0.5%
โโFunctional modules: pulse power supply/online monitoring/automatic refilling/formula management
4. Main applications
Logic/storage device interconnection
Advanced packaging bumps
MEMS metallization
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
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Equipment features: 1. Core advantages Fully automatic high-speed inventory, 20 times more efficient...
โโEquipment features: 1. Process principle โโDeposition mechanism: Potential-controlled directional deposition...
High-purity inert glove box system Equipment features: 1. Ultra-pure environment control Oโ/HโO๏ผ0.1ppm...
Tunnel furnace 1. Equipment features: Continuous conveyor belt/track conveyor Multiple temperature zones...
Vacuum furnace 1. Equipment features: Working temperature: 0-250โ Ultimate vacuum: 133Pa Furnace volume:...
High temperature furnace 1. Core parameters Limit temperature: 1500-1800โ Working temperature: 1450-1750โ...
1. Core performance Temperature range: 200-1300โ Temperature change rate: โค150โ/s (standard bare die...
1. Core functions Global surface flattening Single/double-sided polishing process Multi-material compatible...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
