Deep RIE System (SiOx, SiNx and Deep Si Etching)

High-density plasma metal etching system
Core advantages:
1. Excellent process performance

Designed for 6/8-inch wafer metal dry etching

Excellent aluminum interconnect morphology control capability (sidewall angle controllable)

Achieve high etching rate (>1μm/min) and excellent uniformity (≤±3%)

Extremely low particle contamination (<10 counts/wafer) and defect rate

2. Intelligent system architecture Modular multi-chamber cluster design:

Metal etching dedicated reaction chamber;

Degumming cleaning chamber

Optional pre-cleaning/post-processing module

Fully automatic parallel processing capability, support Cassette-to-Cassette operation

3. Reliable production guarantee

Optimized PM maintenance cycle (>5000 RF hours)

Equipped with intelligent early warning and remote diagnosis system

Stable mass production performance (uptime >95%)

4. Wide range of process applicability

Support Al/Cu metal interconnect etching

Compatible with hard mask and photoresist processes

Expandable to advanced packaging applications

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Application Areas

Each piece of equipment serves a purpose in advancing the study of MEMS devices, LiTaO3, PZT（PbZrTiO₃）, photodiodes, metal oxides, metals and other semiconductors.
The materials and technologies listed in this presentation are carefully selected to support the development and production of cutting-edge sensors. Each component is tailored for the fabrication of the sensors previously outlined, including metal oxide sensors, optical detectors, gas detection technologies, and piezoelectric/pyroelectric devices. The selected technologies ensure compatibility with 6-inch wafers to meet the requirements of industrial-scale manufacturing processes.
Every step of the process, from material preparation to device assembly, has been optimized to support high-volume production while maintaining the flexibility to accommodate a variety of sensor types, including MEMS devices, UV/IR sensors, and biosensors. The focus remains on ensuring the integration of the most reliable and efficient technologies to produce high-quality sensors for diverse applications.

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IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

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We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

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Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

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PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.