Introduction
Using aโDetach Coreโwhich has two-layers carrier foil structure on the surface as a core, and forming a multilayer board by lamination Process. Delamination the board by separating from the two-layers carrier foil, removing the โdetach Coreโ, and splitting in two boards without core, which call โcorelessโ. Extremely thin board and odd-layers structures can be formed by this coreless process.
Coreless process is widely used in applications where thin board thickness requirement, and the process is as follows
Process schematic diagram
Introduction
ETS(Embedded Trace Substrate) process, is a kind of coreless process, the difference is: There is a the circuits pattern layer formed on the surface copper foil of detach core, and then laminating prepreg on the circuits pattern layer which the fine trace is embedded in the dielectrics; separating the multi-layer board to two boards; removing the surface copper by etching and forming a โEmbedded TraceโLayer finally.
The ETS substrate is used in extremely high intensive I/O count applications, such as memory chips, and the process is as follows
Process schematic diagram
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Using aโDetach Coreโwhich has two-layers carrier foil structure on the surface as a core, and forming...
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Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow๏ผFirst depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
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Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
Equipment features: 1. Using maskless direct writing lithography technology, high-precision electron...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
