Ceramic Package

Showing all 10 results

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  Butterfly package

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  Ceramic ball array housing (CBGA)

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  Ceramic double row direct insertion package (CDIP)

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  Ceramic four-sided lead flat package (CQFP)

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  Ceramic leadless chip carrier housing (CLCC)

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  Ceramic needle grid matrix encapsulated (CPGA)

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  Ceramic small form factor packaged (CSOP)

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  Pottery and porcelain DIP

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  Pottery and porcelain QFP

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  Pottery and porcelain SOP

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