The ceramic components of alumina (AL₂O₃) surgical instruments can withstand up to 1400℃ through gradient sintering process, and the bending strength is still greater than or equal to 400MPA after 1000 times of autoclave sterilization.
The whole system of materials passes FDA 21 CFR 820, EU MDR ANNEX XV and ISO 13485 system certification, and the production process adopts clean room grade CLASS 1000 environment.
We adopt the modular flexible production line (minimum starting order of 50 pieces) and AI rapid proofing system. The delivery cycle of standard products is 7 days, and the customized scheme design cycle is 72 hours. After-sales service to provide 24 / 7 remote process debugging and lifelong material upgrade service
Using 3D printed silicon nitride (SI₃N₄) substrate technology, it supports microchannel structures with line width accuracy ±2ΜM and aperture ≤30ΜM, capable of integrating biosensors and micro-pump systems. In blood glucose monitoring patches, the detection sensitivity is improved to 0.1MMOL/L, and the response time is shortened to 3 seconds.
Zirconia (ZRO ₂) ceramic tube shell by nano-scale surface polishing process, surface roughness <0.05 Μ M. Combined with laser gas tight sealing technology, it can withstand 108 mechanical cycles and ensure the stable operation of implanted devices for more than 20 years.
Gallium nitride (GAN) power module adopts high temperature co-fired ceramic (HTCC) packaging technology, the voltage level is more than 650V, the leakage current is less than 0.1 Μ A, which meets the safety standard of IEC 60601-1 of medical equipment. In the case of portable defibrillators, charging efficiency is increased by 35% and volume is reduced by 50%.
Collaborative innovation through Materials-Process-design: 1.Volume of motor controller reduced by 40% (reduce copper consumption by 28%) 2.Car-charger (OBC) assembly time down by 55% (modular package design) 3.System life cycle extended to 15 years / 300,000 km (reduced warranty cost) 4.The ECU package module maintenance rate decreased by 62%
We provide special solutions for millimeter-wave radar: 1.Stable dielectric constant: 77 GHZ frequency band Ε R=9.2 ± 15 (temperature coefficient <30 PPM /℃) 2.Signal integrity: Insertion loss <0.08DB / MM @ 100 GHZ 3.Miniized package: Support 2424MM² package size (integrated 12 channel antenna array)
Through AI optimization of the substrate cutting process (30% increase in wafer utilization rate of 30%) and large-scale extension molding technology, SIC wafer cost is 25% lower than that of international brands, and the price of ceramic carrier plate is only 1 / 3 that of the traditional platinum electrode solution. At the same time, the design of high thermal conductivity substrate can reduce the input of heat dissipation module and improve the comprehensive energy efficiency by 20%.
We use 3D printed ceramic substrate technology to support a micro-interconnected structure with line width accuracy of ± 5 Μ M and aperture of 50 Μ M, which can carry the heterogeneous integration requirements of IGBT module and AI chip. In the onboard ECU carrier plate scheme, the chip package volume is reduced by 60%, and the signal delay is reduced to 0.1 P S/MM.
Aluminum nitride (ALN) ceramic tube shell through multilayer compaction sintering process, porosity <0.01%, air tightness reaches the MIL-STD-883H standard, can withstand-40℃ ~150℃ extreme temperature cycle and 15G mechanical vibration. With the lidar (LIDAR) sensor, the detection distance can be increased to 300 meters, and the failure rate is less than 0.01%.
Silicon carbide (SIC) MOSFET module adopts high temperature co-fired ceramic (HTCC) packaging technology, withstand voltage level of more than 1200V, with low conduction resistance (RDS (ON) <5 MΩ), the charging efficiency of 800V high voltage platform of electric vehicles can be increased to 98%, and the charging time can be shortened by 40%. The vehicle range is increased by 12%, and the volume of the battery thermal management system is reduced by 35%.
Provide the whole-process customization service: Optimization of material formulation (40% increase in thermal conductivity or precise control of dielectric constant) Precision machining capacity (± 0.005MM size tolerance, support for alien structure) Surface treatment technology (gold-plated / silver thickness up to 3 Μ M to meet the space welding requirements) Customer value: Avoid 80% compatibility issues and ensure seamless connection with existing space systems
1.Power device volume is reduced by 40% 2.System heat dissipation cost is reduced by 28% 3.The module average interfault interval (MTBF) is increased to 50,000 hours.
Comparative analysis of on-orbit satellite data: 1.Communication load weight reduction of 48% (ceramic tube shell lightweight design) 2.In-orbit maintenance costs are reduced by 62% (material life>15 years) 3.22% (Modular Design Optimized Load Space)
Our products use the third generation of semi-semiconductor materials (such as silicon carbide, gallium nitride) and high-purity ceramic composite materials, through: 10 0,000 hour life test: simulate space radiation, extreme temperature (-200℃ to 1000℃) and vibration environment to ensure long-term stable operation. Military-grade packaging process: the sealing is IP69K, corrosion resistant and impact resistant. Customer value: reduce the failure rate of aerospace equipment, extend the maintenance cycle, and ensure the success rate of missions
Our material is verified by the triple protection system: 1.Radiation resistance reinforcement: SIC substrate + gold palladium alloy shield, total radiation resistance up to 300 K RAD (SI) 2.Wide temperature domain operation: -269°C (liquid helium temperature zone) to + 350°C (NASA-ESA certification) Vacuum compatibility: gas output rate <110 ⁹ TORR · L / S / CM², meet the ASTM E595 aerospace standards
We have developed nanoscale slurry printing technology, which can achieve ceramic tube shell wall thickness less than 0.2MM and bending strength greater than 400MPA, suitable for MEMS inertial navigation and lidar sensors.
Through AI optimization of raw material ratio (loss rate reduced by 30%) and large-scale casting molding process, the cost of our SIC wafer is 25% lower than that of international brands. At the same time, high thermal conductivity substrate design can reduce the investment in heat dissipation module, and improve the comprehensive energy efficiency by 20%.
We have a fully automated HTCC production line (yield 99.5%) and global distributed storage, with a standard delivery cycle of 15 days and a 48-hour air access for emergency orders. After-sales service to provide 24 / 7 remote fault diagnosis and lifelong process upgrade service.
We use 3D printed ceramic substrate technology to support the micro-interconnection structure with line width accuracy of ± 5 Μ M and aperture of 50 Μ M, which can carry the heterogeneous integration requirements of HBM 3 memory and AI processor. The chip package volume was reduced by 60%, and the signal delay was reduced to 0.1 P S/MM.
Our aluminum nitride (ALN) ceramic tube shell passes through the multi-layer compaction sintering process, the porosity is <0.01%, and the air tightness reaches the MIL-STD-883H standard. Combined with laser sealing technology, it can withstand the extreme temperature cycle of-40℃ ~150℃, ensuring zero distortion of high frequency signal transmission of 800G/1.6T optical module in the data center.
Our silicon carbide (SIC) MOSFET module adopts high temperature co-fired ceramic (HTCC) packaging technology, temperature resistance of more than 200℃, thermal conductivity up to 180W / M · K, can improve the power conversion efficiency to 98% (25% higher than the traditional silicon-based devices). The volume of the cooling system is reduced by 50%, and the power consumption is reduced by 30%.
Sapphire (AL₂O₃) optical window is polished by chemical mechanical polishing (CMP). The transmittance of ultraviolet band (200-400NM) is more than 85%, and the transmittance of infrared band (3-5ΜM) is more than 90%. The laser damage threshold is up to 10J/CM² (@1064NM).
We provide modular flexible production line (minimum minimum 50 pieces) and AI rapid proofing system. The delivery cycle of standard products is 7 days, and the design cycle of customized optical packaging scheme is 48 hours. After-sales support for 24 / 7 remote process debugging and lifelong material iteration service (such as anti-reflection plating upgrade).
We use 3D printed silicon nitride (SI ₃ N ₄) substrate technology to support a microoptical structure with line width accuracy of ± 1 Μ M and aperture of 20 Μ M, and can integrate TOF sensor and VCSEL array.
Our zirconium oxide (ZRO ₂) ceramic shell adopts nanoscale surface polishing technology, with surface roughness <0.01 Μ M, combined with 1 co-crystal sealing process, with air tightness of 10 ^ -9 PA · M³ / S (helium leak detection standard), which can be adapted to C band (insertion loss <0.1DB-1565 NM) of 400G / 800G optical module. After purchase, it provides third-party air tightness authentication and multi-channel optical coupling calibration services, compatible with LUMENTUM, II-VI and other mainstream laser chips.
Aluminum nitride (ALN) ceramic thermal sinking substrate adopts gradient cofiring process, thermal conductivity up to 320W / M · K (more than 10 times of traditional alumina), which can control the junction temperature of 1000W laser diode within 85℃, and the life is extended to 50,000 hours.
Customer case data shows that: Lidar emission module yield increased by 22% (thanks to the thermal expansion matching of ceramic carrier plate) Infrared thermal imager assembly time 35% (modular package design) Full cycle maintenance cost of optical system reduced by 41% (material corrosion resistance)
We adopt a military-grade manufacturing system: 1.Nanoscale molding: the thickness tolerance is controlled at ± 0.8 Μ M (in accordance with MIL-PRF-55342) 2.Laser direct writing metallization: line width accuracy of 5 Μ M, adapted to meet the photonic integrated circuit (PIC) packaging requirements 3.Vacuum brazing process: helium leakage rate <110 ⁹ PA · M³ / S, ensuring the long-term vacuum of the optical cavity (based on the ISO 10110 standard test) Not applicable to the X-ray extreme radiation environment
Our ALN ceramic substrate and GAN-ON-SIC scheme have achieved three major breakthroughs: 1.Thermal management innovation: thermal conductivity is> 170W / MK, 300% higher than traditional alumina, ensuring the thermal stability at 1000W / MW ² power density 2.Wavelength consistency: surface roughness <0.05 Μ M, reducing 532 NM laser scattering loss by 67% 3.Long life verification: passed the IEC 60825 standard 2000 hours aging test, light decay <3%
Based on the customer tracking data, our scheme can be implemented by: 1.The communication module is reduced by 35%, significantly reducing the launch cost 2.The system MTBF is increased to 150,000 hours, extending the in-orbit life 3.Overall BOM cost reduced by 18% (5-year cycle)
We offer modular packaging solutions: Standardized component library: covering 7 standard dimensions from C band to KA band Quick customization channel: exclusive engineering team support to complete design iteration within 30 days Heat management patent: the three-dimensional microchannel heat dissipation structure reduces the thermal resistance by 60%
We implement a three-level space quality control system: 1.Gene screening: LIBS laser spectroscopy was used to detect the purity of raw material (> 99.9995%) 2.Dual process certification: IATF 16949 process control + ESA space components standard 3. Environmental simulation test: pass the MIL-STD-810H vibration test + 1000 hours xenon lamp aging test
Our gallium nitride (GAN) -based materials have three breakthrough advantages over traditional silicon-based components: 1.Extreme environmental stability: -55°C to + 200°C full performance fluctuation <2% (measured data) 2.Energy efficiency revolution: Power density increased by 5 times, and satellite energy efficiency increased by 40% + 3.Signal fidelity technology: the insertion loss under the millimeter-wave frequency band is <0.15DB to ensure zero error code for inter-star communication
We provide drone industry-specific services: 724-hour response: issue a preliminary solution to emergency problems within 12 hours. Joint commissioning: engineers can be dispatched for key customers to participate in the installation testing. Value positioning: not only the supplier, but also your UAV reliability partner.
We have a three-pronged approach: Military grade test: Pass MIL-STD-810G vibration test (20-2000 HZ, 3 hours each). Flexible welding process: the fatigue strength of silver copper solder is increased by 70% to prevent solder cracking. Prevent bad review: provide vibration test video + third-party test report double verification.
Our cost-effective advantages are reflected in: Batch discount: 15% step discount for 1,000 orders. Life cycle cost: material life up to 100,000 flight hours, maintenance cost reduced by 50%. Rapid iteration support: help design optimization matching scheme, shorten the customer development of new product cycle by 30%. Value positioning: the initial investment in exchange for long-term reliability, to avoid the crash risk caused by component failure.
We adopt the following technical support: Ultra-low dielectric loss: dielectric constant <5, reduce signal interference, bit error rate reduced by 90%. Multi-layer precision wiring: support 0.1MM line width / line spacing, suitable for millimeter-wave radar and other high-frequency components. Anti-electromagnetic interference (EMI): embedded shielding layer design, passed the FCC PART 15 standard test. Eliminate anxiety: provide sample measurement and feedback measured data.
Designed for a harsh drone environment: Lightweight: The density of ceramic carrier plate is 40% lower than that of traditional metal, which helps reduce the weight and improve the endurance of UAV. High temperature tolerance: can operate stably from-60°C to 350°C, suitable for engine compartment/motor high temperature area. High frequency response: the signal transmission delay is lower than 0.1NS, improving the real-time performance of the flight control system. Value proposition: Choose us = longer flight time + more reliable extreme environment performance.
Full compliance: Complete certification: ISO 13485 medical equipment certification, IATF 16949 automotive grade quality control. Biocompatibility: The ceramic materials pass the USP CLASS VI test, with zero heavy metals. Confidentiality agreement: NDA can be signed for medical customers and provide exclusive supply chain isolation.
We promise to: 15 days without reason to replace: cover the package damage, performance inconsistency and other scenarios. Lifelong technical support: response to quality problems within 24 hours, and field support from engineers if necessary.
Our premium comes from: Cost optimization: increase the thermal conductivity by 30% and reduce the cost of heat dissipation components by 15%. Failure rate: the average after-sales problems are reduced by 60%. Value positioning: 6-12 months can recover the initial investment through cost reduction and efficiency increase.
We provide: Free adaptation analysis: submit design drawings and provide compatibility data within 48 hours. Modular packaging scheme: support standard size (such as TO-8 / TO-5) and customized structure.
Our third-generation semiconductor materials have the following advantages: High temperature stability: stable operation in-50°C to 300°C extremes, suitable for industrial / automotive sensors. High frequency and high efficiency: reduce the sensor signal loss by more than 20%, improve the response speed and accuracy. Long life design: through 1,000 hours of aging test, the life is 3 times longer than the traditional materials. Value positioning: Choose us = higher sensor performance + lower long-term maintenance costs.
We provide an integrated solution of "materials + devices + equipment": Semiconductor equipment: high-precision wafer bonding machine (± 5 Μ M alignment accuracy), ceramic sintering furnace (1600℃ uniform temperature control) Materials and devices: silicon defect density (<100CM ²) and customized loading plates Value point: Customers can improve the efficiency of the whole process from material processing to device packaging by 40%, and the yield is stable at more than 98.5%.
