Product Introduction
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the semi-addition (SAP) process. The representative products include the FCBGA(Flip Chip Ball Grid Array) packaging in the form of flip-chip packaging
Features of this type of product: large size, high multi-layer, high density; It is used for applications with high computing power (HPC), such as GPU, CPU, FPGA, AI computing, 5G/6G and other scenarios.
Package Structure
Features
|
Smaller micro via by new-generation laser drilling machine |
Fine Line/Space by SAP process |
|
Multi-Layer |
Large Unit Size |
High Density |
Build-up Structure
Process Capability
| Process Capability | Applications | |
| · Layer Count | · 6~20 | · CPU、MPU |
| Board Thickness | · 0.2~2.0mm | · GPU |
| · Line/Space | · 9/12μm | · ASIC |
| · Via/Land | · Φ55/85μm | · FPGA |
| POFV(Plating over Filled Via, Via on through hole) | · AI | |
| · SRO | · Φ60μm | · 5G |
| · SRO/Land Reg | · ±12.5μm | · |
| · Surface Finish | · IT、ENEPIG、OSP | · |
| Micro bump Pitch | · 110μm | |
Roadmap-FCBGA
Support FCBGA by BT material: max.16Layers with L/S=12/12um；
FCBGA（Flip Chip Ball Grid Array）Due to its high-density interconnection, excellent heat dissipation and electrical characteristics, packaging substrates are widely used in the following fields with high requirements for performance, reliability and integration.
1. High-performance computing: CPU, GPU, FPGA and other high-performance chips.
2.Artificial intelligence and machine learning: AI accelerators (such as TPU, NPU), deep learning chips. Heat dissipation capacity can cope with long-term high-load computing.
3.Network and Communications: 5G base station chips, high-speed switches/routers, optical modules.
4.Automotive electronics: autonomous driving chips, ADAS controllers, and in-vehicle infotainment systems.
5.Data center and server: server CPU, memory controller, PCIe accelerator card.
6.Consumer electronics: game console SoC, high-end laptops, AR/VR devices. Support high-performance integration in a limited space, balance power consumption and heat dissipation, and improve user experience.
7.Industrial and medical equipment: industrial automation controllers, medical imaging equipment (such as MRI, CT).
8.Military and aerospace: radar systems, satellite communications, missile guidance. The extreme temperature resistance and radiation resistance design meet military standards (MIL-STD-883) to ensure the reliability of equipment under extreme conditions.
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The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
