Probe station and AOI test equipment

Equipment features:

1. Non-destructive precision testing

Micrometer-level probe contact technology (minimum support <10μm Pad)

Optical alignment system (microscope + CCD) positioning accuracy ±0.1μm

Wafer samples are fully retained to support multiple rounds of R&D verification

2. Efficient testing capabilities

Fully automatic probe station (Auto-Prober) configuration

Thousands of chip tests can be completed per hour

Supports fully automatic testing of 6/8/12-inch wafers

3. Intelligent control system

High-precision motion platform (repeat accuracy ±0.5μm)

Multi-channel signal acquisition system
Real-time data monitoring and analysis function

Expand more Read Less

Chat Now

Application Areas

Each piece of equipment serves a purpose in advancing the study of MEMS devices, LiTaO3, PZT（PbZrTiO₃）, photodiodes, metal oxides, metals and other semiconductors.
The materials and technologies listed in this presentation are carefully selected to support the development and production of cutting-edge sensors. Each component is tailored for the fabrication of the sensors previously outlined, including metal oxide sensors, optical detectors, gas detection technologies, and piezoelectric/pyroelectric devices. The selected technologies ensure compatibility with 6-inch wafers to meet the requirements of industrial-scale manufacturing processes.
Every step of the process, from material preparation to device assembly, has been optimized to support high-volume production while maintaining the flexibility to accommodate a variety of sensor types, including MEMS devices, UV/IR sensors, and biosensors. The focus remains on ensuring the integration of the most reliable and efficient technologies to produce high-quality sensors for diverse applications.

Expand more Read Less

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.