Electroplating equipment

Equipment features:
1. Process principle
Deposition mechanism: Potential-controlled directional deposition of metal ions (Cu²⁺/Ni²⁺), rate 0.1-10μm/min
Function realization:
Conduction: Cu resistivity ≤2.0μΩ·cm
Heat dissipation: Cu thermal conductivity ≥400W/m·K
Support: Adjustable stress ±100MPa
2. Process application
Interconnection technology:
Cu interconnection: Damascus/dual damascene process, uniformity ≤±3%
TSV filling: aspect ratio 10:1, void ratio <0.1%
UBM: Ti/Cu/Ni stacking, thickness accuracy ±5nm
3. Technical advantages
Precision control:
Current density ±1mA/cm²
Temperature ±0.5℃
Additives ±0.5%
Functional modules: pulse power supply/online monitoring/automatic refilling/formula management
4. Main applications
Logic/storage device interconnection
Advanced packaging bumps
MEMS metallization

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Application Areas

Each piece of equipment serves a purpose in advancing the study of MEMS devices, LiTaO3, PZT（PbZrTiO₃）, photodiodes, metal oxides, metals and other semiconductors.
The materials and technologies listed in this presentation are carefully selected to support the development and production of cutting-edge sensors. Each component is tailored for the fabrication of the sensors previously outlined, including metal oxide sensors, optical detectors, gas detection technologies, and piezoelectric/pyroelectric devices. The selected technologies ensure compatibility with 6-inch wafers to meet the requirements of industrial-scale manufacturing processes.
Every step of the process, from material preparation to device assembly, has been optimized to support high-volume production while maintaining the flexibility to accommodate a variety of sensor types, including MEMS devices, UV/IR sensors, and biosensors. The focus remains on ensuring the integration of the most reliable and efficient technologies to produce high-quality sensors for diverse applications.

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IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

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We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

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Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

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PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.