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Wire&Die Bonder Machine

1. Core performance
Ultra-high precision alignment: ยฑ0.1ฮผm (optical/mechanical)
Wide temperature range control: 25-1000โ„ƒ (resistance/infrared heating)
Intelligent pressure system: 0.1-100kN (mechanical/air pressure)
2. Key technologies
a. Environmental control:
Vacuum/inert gas bonding chamber (Nโ‚‚/Hโ‚‚)
Anti-oxidation pollution design
b. Quality monitoring:
Infrared sensor real-time detection
Laser interferometer interface analysis
3. Typical applications
3D IC integration (TSV interconnection)
MEMS device packaging
Power device manufacturing
CIS image sensor

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Application Areas

  • Each piece of equipment serves a purpose in advancing the study of MEMS devices, LiTaO3, PZT๏ผˆPbZrTiOโ‚ƒ๏ผ‰, photodiodes, metal oxides, metals and other semiconductors.
  • The materials and technologies listed in this presentation are carefully selected to support the development and production of cutting-edge sensors. Each component is tailored for the fabrication of the sensors previously outlined, including metal oxide sensors, optical detectors, gas detection technologies, and piezoelectric/pyroelectric devices. The selected technologies ensure compatibility with 6-inch wafers to meet the requirements of industrial-scale manufacturing processes.
  • Every step of the process, from material preparation to device assembly, has been optimized to support high-volume production while maintaining the flexibility to accommodate a variety of sensor types, including MEMS devices, UV/IR sensors, and biosensors. The focus remains on ensuring the integration of the most reliable and efficient technologies to produce high-quality sensors for diverse applications.

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

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