Technical description of X-ray detection system
1. Detection principle
a. X-ray generation mechanism
High-voltage electron beam (30-160kV) bombards metal target (tungsten/copper)
Generates X-ray beam with wavelength range of 0.01-10nm
Forms directional beam through collimator
b. Material interaction
Density difference imaging principle:
High-density materials (such as lead) have absorption rate > 90%
Low-density materials (such as plastic) have absorption rate < 20%
Atomic number (Z) and absorption coefficient are in cubic relationship
2. Imaging technology
a. 2D digital imaging (DR)
Single-shot imaging
Real-time imaging frame rate: 30fps
Typical applications:
Solder joint integrity detection
Component position verification
Foreign body screening
b. 23D-CT imaging
Multi-axis motion system:
Rotation axis accuracy: 0.01ยฐ
Translation Axis resolution: 1ฮผm
3D reconstruction algorithm:
Reconstruction time of 512ยณ voxels <3min
Defect recognition sensitivity: 10ฮผm
3. System configuration
โโa. Core components
X-ray source:
Open tube design (lifetime โฅ20,000h)
Focus size: 5ฮผm~1mm optional
Flat-panel detector:
Resolution: 2048ร2048 pixels
Dynamic range: 16bit
โโb. Analysis function
Automatic defect recognition (ADR)
Dimension measurement accuracy: ยฑ5ฮผm
Material thickness analysis
4. Typical applications
a. Semiconductor packaging inspection:
Solder ball void analysis (detection rate > 99.9%)
Wire bonding status
b. PCB assembly verification:
Buried hole interconnection detection
Component misalignment identification
c. Industrial nondestructive testing:
Casting internal defects
Composite material delamination
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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
