Equipment features:
โโ1. Fully automatic and efficient etching system
Using high-density plasma technology to achieve ultra-high-speed etching of compound semiconductor materials; supporting fully automatic parallel process processing, significantly improving production efficiency
โโ2. Multi-size wafer compatibility
Adaptable to 4/6/8-inch wafer specifications, equipped with intelligent wafer recognition and automatic calibration system
โโ3. Strong bonding material processing capability
Plasma source designed specifically for high bond energy materials, optimized RF power coupling system, to ensure stable and efficient etching performance
โโ4. Wide range of material applicability
Supports etching of a variety of compound semiconductor materials: third-generation semiconductors: silicon carbide (SiC), silicon nitride (SiโNโ) new functional materials: aluminum scandium nitride (AlScN), aluminum nitride (AlN), metal materials: molybdenum (Mo), ferroelectric materials: lead zirconate titanate (PZT)
โโ5. Scientific research-level process control
Precise process monitoring system; programmable process parameter control; real-time data acquisition and analysis function
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
Equipment features: 1. Using maskless direct writing lithography technology, high-precision electron...
Equipment features: 1. Core advantages Fully automatic high-speed inventory, 20 times more efficient...
โโEquipment features: 1. Process principle โโDeposition mechanism: Potential-controlled directional deposition...
High-purity inert glove box system Equipment features: 1. Ultra-pure environment control Oโ/HโO๏ผ0.1ppm...
Tunnel furnace 1. Equipment features: Continuous conveyor belt/track conveyor Multiple temperature zones...
Vacuum furnace 1. Equipment features: Working temperature: 0-250โ Ultimate vacuum: 133Pa Furnace volume:...
High temperature furnace 1. Core parameters Limit temperature: 1500-1800โ Working temperature: 1450-1750โ...
1. Core performance Temperature range: 200-1300โ Temperature change rate: โค150โ/s (standard bare die...
1. Core functions Global surface flattening Single/double-sided polishing process Multi-material compatible...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
