Pottery and porcelain QFP

Core advantages of CQFP

1. High density and high performance combined

Four-sided lead layout: The leads are distributed on the four sides of the package, supporting high number of leads (usually 64-304 leads), and the spacing can be as low as 0.4MM, which meets the high density integration requirements of complex integrated circuits.

Flattened design: low package height (1.0-4.0MM), compatible with surface mount technology (SMT), suitable for modern high-density PCB layout.

2. Excellent reliability and environmental adaptability

Extreme temperature resistance: Ceramic substrate (alumina or aluminum nitride) can withstand-55°C to +175°C, gas tight leakage rate <5 x 10⁻⁸ ATM·CC³/SEC (in line with MIL-STD-883), suitable for high temperature, high humidity and vacuum environment.

Anti-mechanical stress: The ceramic structure has excellent anti-vibration and anti-bending performance, suitable for high vibration scenarios such as vehicle and aerospace.

3. High frequency and heat dissipation performance optimization

Low parasitic parameters: short pins and symmetrical layout reduce inductor/capacitor effects, support high frequency signal transmission (10 GBPS), insertion loss <0.5 DB @10 GHZ.

High efficiency heat dissipation: the high thermal conductivity of ceramic substrate (aluminum nitride thermal conductivity 170 W/MK) combined with metal heat dissipation layer, the thermal resistance (ΘJA) is as low as 15-30°C/W, suitable for high power chips.

• Key technical indicators in industrial applications

1. Packaging specifications and electrical performance

Pin number and spacing: standard pin number 64-304, spacing 0.4-1.0MM (ultra fine spacing can reach 0.3MM).

Signal integrity: supports high-speed signal transmission (PCIE 4.0), transmission rate> = 16 GT/S, return loss <-20 DB.

2. Limit working parameters

Temperature range: military grade-55°C to +175°C, industrial grade-40°C to +125°C.

Thermal cycle capability: through 500 cycles from-65°C to +150°C, the weld point is not cracked.

3. Material and process standards

Ceramic substrate process: high temperature co-fired ceramic (HTCC) ensures the density and mechanical strength of multi-layer wiring, alumina purity>96%.

Air tightness verification: helium mass spectrometry leak detection and HAST (high pressure accelerated aging test) to ensure long-term sealing.

• Typical application scenarios

1. High frequency communication and computing equipment

5G base station RF module: supports millimeter wave band (28/39 GHZ) signal processing, suitable for high frequency low loss requirements.

Data center switching chip: high pin density to meet the high speed SERDES interface requirements of 100G/400G optical modules.

2. Aerospace and defense industry

Satellite navigation processor: radiation resistant ceramics (total dose> 100 KRAD) to ensure long-term operation in space environment.

Airborne radar signal processing: withstand high altitude low temperature (-55°C) and instantaneous power shock.

3. Automotive and industrial electronics

Autonomous driving domain controller: high density packaging requirements for multi-sensor data fusion chips.

Industrial PLC main control chip: corrosion resistant ceramic is suitable for high temperature and dust environment in chemical plants.

• Future development trend

1. Ultra-high density and heterogeneous integration

3D-IC stacking: multi-layer interconnection is achieved through silicon through-hole (TSV) and micro-bump technology, and the number of pins exceeds 500+.

Photoelectric co-packaging: integrated laser and silicon photonic chip for CPO (co-packaged optical) module to reduce optical interconnect power consumption.

2. Material and process innovation

Aluminum nitride ceramics are popularized: replacing alumina, the thermal conductivity is increased to 170 W/MK, and the thermal resistance is reduced to less than 10°C/W.

Low temperature co-fired ceramic (LTCC): integrated embedded passive components (resistance/capacitance), reducing package volume by 30%.

3. Intelligence and green manufacturing

AI-driven design optimization: Machine learning automatically optimizes pin layout and heat dissipation path, increasing yield by 15%.

Lead-free and circular economy: development of bio-based solder and recyclable ceramics, reducing carbon emissions by 40% (in line with the EU Green Agreement).

4. Expansion of emerging areas

Quantum computing control module: suitable for ultra-low temperature packaging of superconducting qubits (below 4K), low temperature thermal matching material is the key.

Brain-computer interface chip: miniaturized CQFP (size <5MM²) for implantable neural signal processing.

• Market prospect forecast

According to YOLE data, the global ceramic QFP market size is about $1.2B in 2023, and it is expected that:

$1.6B by 2025 (CAGR 10.2%)

Breakthrough $2.5B (CAGR 12.5%) by 2030

Growth drivers:

1. Global 5G base station construction (up 25% annually)
2. Commercial space development (satellite manufacturing costs reduced by 60 per cent)
3. Automotive electronics upgrade (L4 autonomous driving penetration increase)

Ceramic QFP (CQFP) holds a central position in 5G communications, aerospace, and autonomous driving due to its high density, high frequency performance, and military-grade reliability. In the future, with breakthroughs in 3D integration, optoelectronic fusion, and green manufacturing technologies, CQFP will evolve towards ultra-high frequency (Terahertz), ultra-thin (thickness <1 MM), and multifunctional applications, penetrating into cutting-edge fields such as quantum computing and bioelectronics, becoming the cornerstone packaging solution for next-generation high-value-added electronic systems. Its technological iteration path will focus on “higher density, lower power consumption, and broader adaptability,” continuously pushing the boundaries of advanced electronic packaging technology.