Ceramic ball array housing (CBGA)

1. Ultra-high density interconnection capability

Ball array layout: supports hundreds to thousands of I/O (4002500+ balls), ball spacing can be as low as 0.5MM, far more than traditional QFP packaging.

Short interconnect path: the solder ball directly connects the substrate and PCB, reducing parasitic inductance (<0.1NH) and improving high-speed signal integrity (>10GHZ).

2. Excellent thermal management performance

High thermal conductivity ceramic substrate: The thermal conductivity coefficient of ALN substrate is up to 150200 W/M·K, which can be integrated with copper column or metal cover (thermal resistance as low as 28°C/W).

Bottom heat dissipation design: direct heat dissipation through solder balls or metal pads, supporting 50300W high power chips (CPU/GPU).

3. Environmental reliability and long life

Air tightness is optional: metal or glass sealed version leakage rate <1 x 10⁻⁸ ATM·CC³/SEC, meeting MILSTD883 standard.

Extreme environment: working temperature 55°C to +200°C, resistant to humidity and heat, salt spray and mechanical impact (vehicle, aerospace applications).

4. Mechanical stability

Resistant to deformation: thermal expansion coefficient (CTE) 67 PPM/°C, better compatibility with PCB than plastic BGA, reducing the risk of thermal cycle failure.

• Prominent technical indicators in industrial applications

| qualification         | Typical values/characteristics                  | Application impact

| Number of solder balls / spacing | 4002500+ solder balls, spacing 0.51.27MM | Ultra-high density IC packaging (FPGA, AI acceleration chip)

| Thermal resistance (RTH) | 28°C/W (ALN substrate + copper column heat dissipation) | Supports 200W+ power devices (HPC chips)

| frequency response         | DC~40GHZ+ (LTCC optimized design) | 5G millimeter wave, optical communication DSP chip

| Air tightness grade | Optional air tight/non-air tight version             | Aerospace/medical needs airtight, consumer electronics can reduce costs

| Mechanical reliability | Drop resistance>5000 cycles (JEDEC) | Vehicle electronics vibration resistance requirements

• The most suitable application scenarios

1. High performance computing (HPC) and AI

Server CPU/GPU: Nvidia A100, Intel Xeon processor ceramic heat dissipation optimized version.

FPGA accelerator card: XILINX VERSAL ACAP chip high temperature resistant packaging.

2. Communications infrastructure

5G base station AAU: high frequency packaging of millimeter wave RF front end module (28/39GHZ).

Optical module engine: 800G/1.6T Co-packaging of DSP and optical devices for coherent optical communication (CPO).

3. Aerospace and defense

Spaceborne computer: long-term reliable packaging of radiation-hardened processors (RISCV architecture).

Electronic warfare system: high frequency signal processing module (X-band radar).

4. Automotive electronics (high-end scenario)

Autonomous driving domain controller: thermal solution for high-power chips (NVIDIA THOR).

On-board radar: MMIC package for 4D imaging radar (77GHZ).

• Future development trend

1. 3D integration and heterogeneous packaging

Silicon interlayer integration: 3D stacking (CPU+HBM memory) is achieved through TSV, with bandwidth>1TB/S.

CHIPLET Technology: Multi-chip CBGA packaging (INTEL EMIB solution) to reduce cost and improve yield.

2. High frequency and terahertz adaptation

Ultra-low loss LTCC: Develop glass ceramics with DK <3.5 to support 100GHZ + terahertz communication (6G).

RF optical hybrid integration: the photonic IC is co-packaged with the RF front end (LIDAR).

3. Heat dissipation technology revolution

Two-phase microchannel cooling: embedded evaporative cooling, solving the heat flux density>500W/CM².

Diamond substrate: local deposition of diamond (thermal conductivity> 2000 W/M·K) for heat dissipation in hot spots.

4. Cost optimization and standardization

Large panel level packaging: 600x600MM² large-scale production of ceramic substrate, cost reduction of more than 30%.

Lead-free solder replacement: Copper column bump (CU PILLAR) replaces tin balls to improve reliability and comply with environmental regulations.

5. Expansion of emerging areas

Quantum computing: cryogenic CBGA packaging of superconducting qubit control circuits (<4K).

Space economy: The need for low-cost, highly reliable packaging of giant constellation satellites (KUIPER).

CBGA packaging, with its ultra-high density, superior heat dissipation, and reliability, has become a core solution in HPC, communications, and aerospace. In the future, through the integration of 3D technology, CHIPLET, and advanced thermal management materials, its applications will expand to cutting-edge fields such as terahertz communication and quantum computing. As ceramic substrates achieve large-scale production and design standardization, CBGA is poised to transition from “high-end specialized” to “high-performance universal,” becoming the cornerstone of packaging for next-generation computing and communication equipment.