High reliability, ultra-low consumption, full frequency domain —— drives the ultimate engine of air and space interconnection

Deepetch Semicon, as the “center of nerve” of satellite communication, is pushing the global communication network towards the era of integration of air and earth with disruptive technological breakthroughs. Through the advanced process and heterogeneous integrated design below 7 NM, the chip realizes ultra-high computing density, nanowatt-level power control and multi-frequency dynamic adaptation capability, completely solving the core pain points of “limited bandwidth, sensitive delay and complex environment” in satellite communication.

At the satellite payload end, the phased array T / R chip achieves 256-channel beam formation at a yield of 99.9%, reducing the power consumption of the starborne antenna by 40%, and directly promoting the mass deployment of low-orbit satellite constellation (such as SPACEX starlink). In the ground receiving equipment, the high-throughput modem SOC chip supports the 4K video transmission of satellites directly connected to mobile phones, making real-time communication in no-man’s areas such as desert and ocean possible.

The innovation of semiconductor chips has spawned the scene revolution of satellite communication:

Emergency relief: a portable terminal equipped with AI edge computing chip can realize disaster modeling and rescue path planning within 10 seconds through satellite in the network disconnection environment;

Smart Ocean: Based on Beidou Internet of Things buoys, the Marine environmental data can be transmitted back to the world every 5 minutes;

Aerospace: Gallium nitride (GAN) power chips reduce the weight of airborne satellite communications systems by 50% and increase flight WI-FI rates to over 200MBPS.

With the evolution of 6G converged communication standards, the terahertz frequency band support capability of semiconductor chips and quantum encryption integration technology are expanding new imagination space. From a single chip driving a cubic star to a computing chip cluster building a “space data center,” every iteration of semiconductor technology is rewriting the rulebook for satellite communications. In the future, when 3D stacked chips meet photonic integrated circuits, satellite communication will cross the “bandwidth wall” and “energy consumption wall”, truly realizing the ultimate vision of “everything can be connected by satellites”.