1. Mechanical stripping method (SCOTCH TAPE method)
Process: High oriented pyrolytic graphite (HOPG) is repeatedly peeled off with tape until a single layer of graphene is obtained.
characteristic: The highest purity (defect rate <0.1%) but very low yield (micron-sized fragments). Suitable for laboratory basic research (such as verification of quantum Hall effect).
2. Chemical vapor deposition (CVD)
flow path:
1. The metal substrate (copper/nickel) is annealed at high temperature (1000โ) to form a flat surface;
2. Methane (CHโ) and other carbon sources are introduced to catalyze the cracking of carbon atoms;
3. Carbon atoms self-assemble into graphene films;
4. Transfer to the target substrate (such as SIOโ/SI or flexible PET) by etching.
characteristic:
Continuous thin films can be prepared at wafer level (more than 30 inches);
Industrial-grade core processes, such as Samsung and Huawei, are used for flexible screens.
3. REDOX method
flow path:
1. Graphite is strongly oxidized by concentrated sulfuric acid/potassium permanganate to produce graphene oxide (GO);
2. GO ultrasonic dispersion into a single layer solution;
3. Chemical reduction (hydrazine hydrate, ascorbic acid) restores conductivity.
characteristic:
Low cost (<$50/G), suitable for mass production;
4. Liquid phase stripping method
Process: Graphite powder is dispersed in solvent (NMP, DMF), and then peeled into single layer graphene by ultrasonic or high pressure homogenizer.
characteristic:
Yield up to 80% (British HAYDALE technology);
Suitable for printed electronics (ink concentration up to 5 MG/ML).
1. Physical and chemical properties
| performance index ย ย ย ย ย ย ย ย ย ย ย | Values/characteristics ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย |Compare materials (such as silicon, copper) ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย | |carrier mobility ย ย ย ย ย ย | 200,000 cmยฒ/(Vยทs)(theoretical value) ย ย ย ย ย ย | silicon๏ผ1,400 cmยฒ/(Vยทs)
| heat conductivity ย ย ย ย ย ย ย ย | 5,300 W/(mยทK)(single layer) ย ย ย ย ย ย ย ย ย ย ย ย | copper๏ผ400 W/(mยทK)
| tensile strength ย ย ย ย ย ย ย | 130 GPa ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย | steel๏ผ0.4 GPa
| ย light transmittance ย ย ย ย ย ย ย ย ย | 97.7%๏ผ550 nmwavelength๏ผ ย ย ย ย ย ย ย ย ย ย ย ย ย ย | ITO๏ผIndium Tin Oxide๏ผ๏ผ~90%
| specific area ย ย ย ย ย ย | 2,630 mยฒ/g ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย ย | acticarbon๏ผ1,000-3,000 mยฒ/g
| ย chemical stability ย ย ย ย ย | Able to resist acid and alkali (except strong oxidizing acid) ย ย ย ย ย ย ย ย ย | The metal is easily corroded
2. Unique quantum effect
Quantum Hall effect: at low temperature and strong magnetic field, the conductivity is quantized step (precision up to 10โปโน, used for resistance standard). Dirac cone band structure: zero mass fermion properties, supporting ultra-fast electron transport.
1. Electronics and semiconductor devices
high frequency transistor:
Advantages: carrier mobility is 140 times that of silicon, and the operating frequency exceeds 300 GHZ (IBM 2023 prototype).
Technical indicators: Cut-off frequency (Fโ) up to 700 GHZ, power density 1.5 W/MM (1.2 times that of GAN).
Flexible electronics:
Application: Foldable screen mobile phone (HuaweiMATE XS uses graphene heat dissipation film).
Advantages: Flexibility> 1 million times (resistance change <2%), transmittance> 97%.
2. Energy storage and conversion
Lithium-ion battery:
Graphene conductive agent: adding 1% graphene, the internal resistance of the battery is reduced by 20%, and the cycle life is increased by 30% (Ningde Times technology).
Silicon-based anode: capacity up to 2,000 MAH/G (traditional graphite anode 372 MAH/G).
Supercapacitors:
Technical indicators: energy density 30 WH/KG, power density 100 KW/KG (MAXWELL TECHNOLOGIES data).
3. Composite materials
aerospace:
Graphene reinforced aluminum matrix composites: 50% strength increase, 20% weight reduction (part of Boeing 787).
Thermal management materials: thermal conductivity increased to 400 W/ (M K) (traditional polymers <1 W/ (M K)).
Lightweight car: graphene/epoxy composite material improves impact resistance by 80% (Tesla battery case).
4. Biomedicine and sensors
biosensor:
Detection limit: 0.1 PG/ML (Novel Coronavirus antigen detection, 1000 times more sensitive than ELISA).
Response time: <5 seconds (glucose sensor).
Antibacterial dressings: The killing rate of Staphylococcus aureus by graphene oxide dressings was>99.9% (3 hours of contact).
5. Environmental engineering
Seawater desalination membrane:
Performance: water flux 200 L/ (Mยฒ H BAR), salt retention rate 99.9% (MIT 2022 annual experimental data).
Pollution adsorption: Graphene aerogel adsorbs crude oil at a weight ratio of 86 times (ExxonMobil’s offshore oil spill emergency plan).
1. Scale production: CVD cost needs to be reduced to <$50/Mยฒ (currently ~$200/Mยฒ).
2. Number of layers control: the proportion of single layer graphene should be>95% (about 80% by CVD method at present).
3. Doping technology: precise control of nitrogen/boron doping concentration (target: carrier density 10ยนยณ CMโปยฒ).
4. Heterogeneous integration: interface engineering of graphene with GAN and SIC (interface resistance <1 ฮฉ MM).
Graphene has achieved breakthroughs in semiconductors, new energy, biomedical and other fields with its ultra-high electrical conductivity, mechanical strength, light transmittance and chemical stability:
5G communication: graphene RF devices improve efficiency by 40% in the 28 GHZ band;
Space heat dissipation: the weight of satellite thermal control system is reduced by 30%, and the heat dissipation efficiency is increased by 50%;
Medical diagnosis: Ultra-sensitive sensors drive early cancer detection.
With the maturity of technologies such as roll-to-roll CVD and atomic layer deposition (ALD) doping, graphene is expected to make the leap from “lab miracle” to “industrial pillar material” by 2030.
1. Electronics and semiconductor devices
high frequency transistor:
Advantages: carrier mobility is 140 times that of silicon, and the operating frequency exceeds 300 GHZ (IBM 2023 prototype).
Technical indicators: Cut-off frequency (Fโ) up to 700 GHZ, power density 1.5 W/MM (1.2 times that of GAN).
Flexible electronics:
Application: Foldable screen mobile phone (HuaweiMATE XS uses graphene heat dissipation film).
Advantages: Flexibility> 1 million times (resistance change <2%), transmittance> 97%.
2. Energy storage and conversion
Lithium-ion battery:
Graphene conductive agent: adding 1% graphene, the internal resistance of the battery is reduced by 20%, and the cycle life is increased by 30% (Ningde Times technology).
Silicon-based anode: capacity up to 2,000 MAH/G (traditional graphite anode 372 MAH/G).
Supercapacitors:
Technical indicators: energy density 30 WH/KG, power density 100 KW/KG (MAXWELL TECHNOLOGIES data).
3. Composite materials
aerospace:
Graphene reinforced aluminum matrix composites: 50% strength increase, 20% weight reduction (part of Boeing 787).
Thermal management materials: thermal conductivity increased to 400 W/ (M K) (traditional polymers <1 W/ (M K)).
Lightweight car: graphene/epoxy composite material improves impact resistance by 80% (Tesla battery case).
4. Biomedicine and sensors
biosensor:
Detection limit: 0.1 PG/ML (Novel Coronavirus antigen detection, 1000 times more sensitive than ELISA).
Response time: <5 seconds (glucose sensor).
Antibacterial dressings: The killing rate of Staphylococcus aureus by graphene oxide dressings was>99.9% (3 hours of contact).
5. Environmental engineering
Seawater desalination membrane:
Performance: water flux 200 L/ (Mยฒ H BAR), salt retention rate 99.9% (MIT 2022 annual experimental data).
Pollution adsorption: Graphene aerogel adsorbs crude oil at a weight ratio of 86 times (ExxonMobil’s offshore oil spill emergency plan).
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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
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